The 2021 International Conference on High Performance Computing & Simulation
The 18th Annual Meeting
10 - 14 December 2020
Barcelona, Spain (Virtual/Online event)
http://hpcs2020.cisedu.info/ or http://conf.cisedu.info/rp/hpcs20
Technically Sponsored by (Forthcoming)
Co-Sponsored by ASIM, EUROSIM, CASS, JSST, LSS, PTSK, TSS
Twitter: @HPCS Conference
FaceBook: HPCS Conference
LinkedIn: HPCS Conference
COVID-19 Announcement 2: The health and safety of our conference participants is our top priority. Under the extenuating circumstances due to the international pandemic, HPCS 2020 is going fully virtual/online. Accepted and presented papers in the HPCS 2020 will be published in the conference proceedings as usual and submitted for inclusion in the Digital Library after they are successfully presented at the virtual conference. Information and instructions on how to prepare for the virtual presentation will be posted and sent separately. Registration fees for the HPCS 2020 will be adjusted accordingly and posted on the HPCS 2020 web site. Please check our website where we will post any relevant information as quickly as it becomes available. Please stay safe and well.
Please note the new dates for HPCS 2020
Authors of selected papers will be invited to submit an extended version of their work for a special issue in an ISI Journal (e.g., FGCS, CCPE, ...). Other special issues will be organizers as well.
Call for Papers and Participation
(Main Track Paper Submission Deadline: 05 September 2020 - Extended)
(Symposia, Workshops and Special Sessions have their own deadlines - please check the track of interest)
The 2020 International Conference on High Performance Computing & Simulation (HPCS 2020) will be held on December 10-14, 2020 in Barcelona, Spain (virtually). Under the theme of “HPC and Modeling & Simulation for the 21st Century," HPCS 2020 will focus on a wide range of the state-of-the-art as well as emerging topics pertaining to high performance and large scale computing systems at both the client and backend levels. Continuing the great success of previous HPCS events, HPCS 2020 is anticipated to attract a large number of high-quality submissions and stimulate cutting-edge research discussions among many pioneering researchers and scientists as well as industry engineers and leaders from all around the world.
HPCS 2020 includes different types of activities and venues for contribution. The HPCS 2020 program will feature a number of symposia, workshops, and special sessions, invited presentations, and exceptional keynote and plenary speakers. It will have tutorials, demos, posters, doctoral dissertation colloquium, panels, exhibits, as well as several social events. The conference welcomes sponsorships of all types as well. More information can be found on the conference website of HPCS 2020 and under the Call for Papers and Participation. Prospective authors are invited to submit original technical papers—up to 8 pages of length. Various HPCS 2020 Symposia, Workshops and Special Sessions may have different deadlines and submission sites, as listed on the conference website and track pages.
The HPCS 2020 Conference Proceedings will be made available at the time of the meeting, and will be submitted to the Digital Library (pending) as in previous years. Selected papers will be further considered for possible publication in special issues in reputable ranked international journals.
HPCS Proceedings will be submitted to the Digital Library and indexed by all major indexing services, including SCOPUS, EI, Sci, dblp, etc., as appropriate. The indexing services make their own decisions.
There will be outstanding paper and poster paper awards as well as outstanding service recognition, certificates and awards. ALL ARE WELCOMED.
* Other Tracks Submission Deadline may vary. Please check the specific track page.
** Proposals for tutorials, panels, demos, posters and exhibits have deadlines as posted on their respective web pages
(see the menu on the left.)
+ Please note that completing the Notifications may take several days.
More Coming Soon.